Devcon Stainless teel Putty(ST) 不銹鋼修補劑(DEVCON 10270,DEVCON ST)是一種不銹鋼填充的環(huán)氧修補劑，可修補不銹鋼設(shè)備，通過了NSF安全認證，準入食品加工行業(yè)。
產(chǎn)品概述:
不銹鋼填充的環(huán)氧修補劑，可修補不銹鋼設(shè)備，通過了NSF安全認證，準入食品加工行業(yè)。
DEVCON STAINLESS STEEL PUTTY (ST)
Description
Stainless steel-filled epoxy putty for patching, repairing and rebuilding stainless steel food processing equipment.
Key Features
Non-rusting
Bonds to ferrous and non-ferrous metals
NSF certified for potable water applications
Acceptable for use in meat and poultry plants
Listed under NSN stock #8030-00-268-7934
Open Time: 5 Minutes
Gap Fill: 0.0625" - .075"
Stock # Size
10270 1 LB
關(guān)鍵詞：Devcon Stainless teel Putty(ST)，不銹鋼修補劑，DEVCON 10270，DEVCON ST
