DOWSIL 3-6752 Thermally Conductive Adhesive
陶熙DOWSIL 3-6752灰色導(dǎo)熱粘合劑是一種單組分熱固化硅酮，用于冷卻電子應(yīng)用，并與金屬、陶瓷、填充塑料、環(huán)氧樹脂層壓板和有機(jī)基材粘合。陶熙DOWSIL 3-6752灰色導(dǎo)熱粘合劑具有阻燃性、自流平性、流動性、觸變性，不含添加溶劑。
Typical Use: Used for bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed.
Brand: DOWSIL
Color: Gray
Components: 1 part
Cure Time: 40min @ 100 °C; 10min @ 125 °C; 3min @ 150 °C
Dielectric Strength: 400 V/mil
Elongation: 15%
Flash Point: >100 °C
Hardness: 87 A
Service Temperature: -45 to 200 °C
Shear Strength: 540
Specific Gravity: 2.6 @ 25 °C
Tensile Strength: 545 psi
Thermal Conductivity: 1.8 W/mK
Viscosity: 81,000
標(biāo)簽:
DOWSIL 3-6752
